Plasma Cleaner & Reaction Systems - Plasma Cleaner Asher Systems

Plasma Cleaner Asher Systems

Plasma Cleaner Asher Systems unit is ideal for applications requiring atomic-level contamination removal, oxide elimination, and hydrophilic or hydrophobic surface treatment. This compact reaction chamber efficiently facilitates surface cleaning and modification.

Plasma characteristics vary significantly across frequencies like 40 kHz, 400 kHz, microwave, and 13.56 MHz RF, affecting plasma density, energy levels, and application suitability. However, depending on the application requirements, it may be feasible to utilize multiple frequencies for enhanced flexibility and tailored treatment outcomes.

In plasma systems, frequency plays a crucial role in determining the movement of ions and electrons and the resulting plasma density:

Low-Frequency (LF) Behavior: At lower frequencies, both ions and electrons have ample time to move within the plasma medium. Since ions carry a much larger mass than electrons and have positive or negative electric charges, their movement can lead to significant sputtering effects. This sputtering can impact the sample surface and contribute to contamination from the chamber walls, transferring a higher heat load to the sample as accelerated particles collide more frequently.

High-Frequency (RF) Behavior: At higher frequencies, ions have less time to respond and move due to their mass, resulting in reduced sputtering. Higher frequencies allow electrons to move more readily, which increases the overall plasma density. RF frequencies, particularly 13.56 MHz, typically yield higher plasma densities than LF, offering greater precision and control in applications where minimal surface impact and lower contamination are desired.

These frequency-dependent effects are crucial when selecting plasma conditions, as LF may be more suited for processes requiring robust material removal, while RF frequencies are preferred for high-density plasma with less sample heating and cleaner surface processing.

Low Frequency Plasma Physical operations

High-frequency plasma systems are ideal for promoting surface-level chemical reactions on a product or sample. Here’s how they excel:

Surface Reactions without Destruction: At high frequencies, the limited ion mobility means ions do not impart destructive force on the sample. Instead, the abundance of electrons generates ions and radicals, creating a plasma that facilitates chemical interactions on the surface without compromising its integrity.

Increased Ion and Radical Density: High-frequency operation maintains a large number of ions and radicals on the surface, readily available for chemical reactions, enhancing processing efficiency for treatments like surface activation or cleaning.

Reduced Internal Bias and Penetration Depth Limitations: With increasing frequency, parameters such as internal bias decrease, reducing the impact on bulk material while focusing energy on surface-level interactions. At higher frequencies (e.g., microwave), plasma shifts from a volumetric state to a surface-concentrated plasma due to penetration depth limits, enhancing uniformity for thin films and coatings.

Key Features and Configuration Options:

Gas Input Options: One or two inputs for gases like Argon, Oxygen, Nitrogen, or forming gas for hydrogen cracking.

Flow Control: Options for either a flow meter or a mass flow controller to precisely manage gas flow rates.

Frequency Selection: Three frequency options, with the potential for RF upgrade if planned during initial configuration.

Heated Sample Capability: Sample heating up to 350°C for applications requiring elevated temperatures.

This high-frequency setup is optimized for precision surface treatment, delivering effective chemical modification and surface cleanliness without surface damage.

Applications

With the optional vapor delivery inlet, the plasma system can incorporate liquid precursors, broadening its application range for advanced material treatments. Additionally, a corrosion-resistant design further extends the system's durability and versatility, making it suitable for the following specialized applications:

Plasma Cleaning: Effective removal of contaminants at the atomic level for enhanced cleanliness and performance.

Plasma Surface Activation: Enhances surface adhesion for improved bonding in subsequent processing or coating applications.

Functional Plasma Coatings: Enables deposition of specialized coatings, adding functionality such as hydrophobicity, conductivity, or chemical resistance.

Plasma Etching: Precision material removal for microfabrication and surface patterning.

PDMS & Microfluidic Devices: Tailored for biomedical and microfluidic applications, supporting plasma bonding and surface treatments.

PEEK & Other Engineering Polymers: Ideal for engineering polymers requiring surface modification for adhesion, coating, or biocompatibility.

PTFE (Polytetrafluoroethylene): Facilitates modifications of this non-stick, high-performance polymer.

Metals: Suitable for surface cleaning, etching, or activation to enhance coatings and adhesion on metallic surfaces.

Ceramics: Enables modifications for improved wettability, adhesion, and surface compatibility.

Glass & Optical Devices: Offers precise treatments for anti-reflective coatings, adhesion promotion, and surface cleaning in optics.

This versatile setup meets the needs of diverse industries, from microelectronics and biomedical to advanced manufacturing, providing reliable plasma treatments with expanded functionality.

Chamber	Size: diameter:125 mm, length: 240 mm. Main body Material: Pyrex. Sample holder: Aluminum
Plasma generator	RF Gen and Auto matching :13.56MHz Power: 0 to 2000w 40Khz 400KHz
Input gas	Two input gas. MFC or needle valve gas control .
Control and Monitor	Graphical and touch control panel Parameters: vacuum pressure, time,rotameter gas flow, plasma power, system components automatic and manual safe enable/disable. Automatic process management.
Plasma Generation	External capacitive electrodes.
Vacuum pump	2-stage Oil-sealed Rotary Vane Pump
Vacuum gauge	Corrosion resistant Pirani gauge
Case	Dimensions: 420500220 mm (W,L,H) Material: Aluminum.
Main input power	220v AC. 50 Hz – 60Hz (110V is also available)

Optional Accessories

Row	System Parameters		Model M2V03- (System options)
			m2v03	m2v03	m2v03	m2v03	m2v03	m2v03	m2v03	m2v03
			-A	-B	-C	-D	-E	-F	-G	-H
1	Chamber body 125mm Dia x 240mm	Pyrex chamber
1	Chamber body 125mm Dia x 240mm	Quartz chamber
2	Plasma Generator	40KHZ
		400 KHZ plasma
		Generator
		RF 13.56MHz
3	Gas flow control	2 needle valves
		Ar+O2 (2 MFC) 200SCCM
	Gas flow monitor	Rotameter
		MFC
4	Control –	Keys –
	Monitoring	Volume
		and digital display
		Graphical touch screen
6	Vacuum Gauge	Pirani corrosion resistive
7	Sample holder	Steel
		Pyrex
		Quartz

8	Vacuum Pump	6 m3/hr 2 stage Rotary	not included
	Oil mist filter		not included

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Plasma Cleaner & Reaction Systems - Plasma Cleaner Asher Systems

Plasma Cleaner Asher Systems

Low Frequency Plasma Physical operations

Applications

Optional Accessories

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